How do they match: Semiconductor Processing Technicians

  • Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

  • Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
  • Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
  • Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
  • Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.

  • Measure ingredients or substances to be used in production processes.